Category: In the News

Sep 15
Muller Technology Launches New In-Mold  | Labeling (IML) Production System at K 2022  

Muller Technology Launches New In-Mold  | Labeling (IML) Production System at K 2022                                        CONTHEY, Switzerland, September 8, 2022 – Muller Technology, a leading global provider of molds and automation solutions for thin-wall packaging, will unveil its latest in-mold labeling […]

Aug 04
Profile Plastics licenses TactoTek® technology creating complete North America IMSE® supply ecosystem

OULU, FINLAND/CHANHASSEN, MINNESOTA, USA –Profile Plastics (www.profilemn.com) has become a TactoTek Design & Innovate licensee, with rights to design and produce in-mold structural electronics (IMSE®) solutions that use TactoTek intellectual property and creating a complete IMSE supply ecosystem in North America. Profile Plastics is an established supplier of precision film-insert-molded (FIM) parts to global automotive […]

Jul 12
Next-Gen In-Mold Labeling Technology Earns RecyClass Approval

MCC Verstraete reports that tests show its NextCycle In-Mould Label technology is fully compatible with Europe’s rigid polypropylene (PP) recycling stream. Both its sorting behavior and recycling compatibility were positively assessed by independent testing facilities. The results show that the recycled material from NextCycle IML packaging can be reused in high-end and closed-loop applications, said […]

Jul 12
Beck Highlights High Demand in IML Solutions

“At the beginning, we assumed that our market entry would be positively evaluated by medical companies. However, we did not expect so much positive feedback and requests,” Ralf Ziemer, sales manager medical at Beck Automation, recalls. It was not only the reactions to the market entry in the social networks that were positive, but also […]

Jul 05
New Patent Grant for PulPac and Dry Molded Fiber

The European Patent Office has decided to grant yet another patent to PulPac. The new patent relates to a method and an apparatus for forming and cutting a compacted edge of a product in a forming mold system using heat and pressure. The patented technology is an important integral part of PulPac’s Dry Molded Fiber […]

Jun 06
Herrods IML Now Operates under MCC Verstraete Australia

It has been known for a while that Multi-Color Corporation (MCC), Batavia, Ohio, acquired the Australian in-mold label manufacturer Herrods IML. Recently, Herrods IML has started a new chapter within this acquisition. As of June 1, 2022, the Australian company has changed its name and branding. The company will continue to operate under the name […]

Apr 05
Heidelberg further expands portfolio for in-mold label and folding carton production

Distribution agreement with AN Corporation of Japan forKawahara postpress products Complete workflow for in-mold label and folding carton production available  Heidelberg presenting Kawahara TXS-1100 blanking systemduring Label Day at Wiesloch-Walldorf site In summer 2021, Heidelberger Druckmaschinen AG (Heidelberg) launched the Generation 4 CutStar, the Speedmaster XL 106-D rotary die cutter, and a new Performance Package for in-mold label production […]

Apr 05
Innovative coffee lid made with PulPac’s Dry Molded Fiber technology in Swedish fast food chain MAX Burgers

Liplid’s uniqe lid, adapted to PulPac’s innovative Dry Molded Fiber technology, enables MAX Burgers to replace plastic coffee lids in restaurants this year.  Every year, more than 300 billion plastic lids – 1.5 million tons of plastic – are produced. Many of them end up as litter in the world’s oceans. A Swedish collaboration between […]

Apr 05
MCC Verstraete introduces SealPPeel, an alternative to aluminum lidding

MCC Verstraete is expanding its product range. The world’s market leader in off-set printed in mold labels proudly introduces SealPPeel, a polypropylene (PP) die-cut heat-seal lidding solution that was developed to optimize the recyclability of PP packaging. Increased recyclability Sustainability has always been a focal point for MCC Verstraete. The company’s key mission is to […]

Mar 31
3D Electronics Enables Greater Integration, Says IDTechEx

3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. While it has long been used for adding antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects, more complex circuits are increasingly being added onto surfaces made from a variety of […]